Title :
Test Instrumentation for a Laser Scanning Localization Technique for Analysis of High Speed DRAM devices
Author :
Versen, Martin ; Schramm, Achim ; Schnepp, Jan ; Diaconescu, Dorina
Author_Institution :
Qimonda AG, Neubiberg
Abstract :
Soft defect localization (SDL) is a method of laser scanning microscopy that utilizes the changing pass/fail behavior of an integrated circuit under test and temperature influence. Historically the pass and fail states are evaluated by a tester that leads to long and impracticable measurement times for dynamic random access memories (DRAM). The new method using a high speed comparison device allows SDL image acquisition times of a few minutes and a localization of functional DRAM fails that are caused by defects in the DRAM periphery that has not been possible before. This new method speeds up significantly the turn-around time in the failure analysis (FA) process compared to knowledge based FA.
Keywords :
DRAM chips; failure analysis; high-speed integrated circuits; integrated circuit reliability; integrated circuit testing; measurement by laser beam; optical microscopy; dynamic random access memories; failure analysis; high speed DRAM devices; image acquisition; integrated circuit; laser scanning localization technique; laser scanning microscopy; soft defect localization; test instrumentation; Circuit testing; Electron microscopy; Electronic equipment testing; Failure analysis; Instruments; Integrated circuit testing; Random access memory; Scanning electron microscopy; Thermal resistance; Voltage;
Conference_Titel :
Design, Automation and Test in Europe, 2008. DATE '08
Conference_Location :
Munich
Print_ISBN :
978-3-9810801-3-1
Electronic_ISBN :
978-3-9810801-4-8
DOI :
10.1109/DATE.2008.4484909
