How is high heat flux cooling technology being driven by supercomputers

Author

Pautsch, Greg

Author_Institution

Cray Inc., Chippewa Falls, WI, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

702

Abstract

To develop new technologies or new techniques to solve thermal and system packaging problems. The solution to these system packaging problems is being complicated with the introduction of new component technologies that have unique thermal and packaging requirements that also now need to be integrated into supercomputers. The cooling of high heat fluxes on components, but also with the integration of new technology with unique thermal design requirements and the integration of their thermal solution into the system design. This paper describes a new system technologies and their thermal and packaging requirements that demand new and unique high heat flux cooling solutions.

Keywords

cooling; integrated circuit packaging; mainframes; systems analysis; thermal management (packaging); heat flux cooling solutions; heat flux cooling technology; supercomputers; system design; system packaging; thermal packaging; thermal solutions; Cooling; Electronic packaging thermal management; Engineering management; Reliability engineering; Supercomputers; Systems engineering and theory; Temperature dependence; Thermal engineering; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1318359

Filename

1318359