DocumentCode :
3243423
Title :
Increasing the switching speed of high-voltage IGBTs
Author :
Robb, Francine ; Wan, Irene ; Yu, Sophie
Author_Institution :
Power Products Div., Motorola Inc., Phoenix, AZ, USA
fYear :
1997
fDate :
26-29 May 1997
Firstpage :
251
Lastpage :
254
Abstract :
The lower on-voltages of IGBTs, as compared to power MOSFETs, make them very attractive for high-voltage applications. Their higher switching losses, however, have limited the IGBT to low (<10 kHz) frequency applications. This paper will discuss the on-voltage/off-energy (Eoff) trade-offs of 1200 V non-punchthrough (NPT) IGBTs. Adjusting the trade-offs by modifying the backside process, by incorporating an annealed aluminum drain contact, and by proton implanting are discussed. A 1200 V NPT-IGBT with a fall time equivalent to a 1200 V power MOSFET, but with one-third its on-voltage, was produced using a 3E12/cm2, 1.6 MeV backside proton implant
Keywords :
annealing; insulated gate bipolar transistors; ion implantation; losses; power semiconductor switches; 1.6 MeV; 1200 V; annealed drain contact; backside process; fall time; high-voltage IGBTs; high-voltage applications; non-punchthrough devices; on-voltages; proton implanting; switching losses; switching speed; Aluminum; Annealing; Boron; Doping; Implants; Insulated gate bipolar transistors; MOSFETs; Medical simulation; Protons; Response surface methodology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and IC's, 1997. ISPSD '97., 1997 IEEE International Symposium on
Conference_Location :
Weimar
ISSN :
1063-6854
Print_ISBN :
0-7803-3993-2
Type :
conf
DOI :
10.1109/ISPSD.1997.601486
Filename :
601486
Link To Document :
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