Challenges in modeling of accelerated life testing ITHERM 2004 panel discussion

This panel discussion will address the current challenges associated with accurate prediction of thermal cycling and drop reliability of electronic packaging using finite element simulations. Several experts in the area of mechanical and thermal modeling of electronic packaging will make up the panel. The panelists come from both academia and industry. Topics of discussion will include improved solder and encapsulant constitutive models, improved solder fatigue and crack growth criteria, improved interfacial and impact failure criteria, challenges in characterizing constitutive behavior of packaging materials, volume averaging and meshing issues, and the relation of accelerated life testing data (e.g. thermal cycling and thermal shock) to actual field life.