DocumentCode :
3243625
Title :
Challenges in accelerated life testing
Author :
Lall, Pradeep
Author_Institution :
Dept. of Mech. Eng., Auburn Univ., AL, USA
Volume :
2
fYear :
2004
fDate :
1-4 June 2004
Abstract :
Accelerated testing typically targets-life estimation and defect or design weakness identification. The intent is to obtain more information from a given test time than would normally be possible. Time compression is typically achieved by acceleration of single or combination of stresses- temperature, vibration, humidity, etc. Short product development schedule, time-to-market requirements and the development timeline often dictate a fixed time under test. In a test-to-fixed life approach, given number of the product are tested to a fixed life, with zero failures allowed. The test demonstrates the product´s minimum reliability, while allowing for a fixed time to conduct testing. In absence of life-test information, the challenge is to decipher if the product may be over-designed or marginally designed. Failure mechanisms and modes observed in accelerated test may not be observed in field life. Accelerated tests such as thermal shock from -55 to 125°C may stress the material beyond the equipment operating range, such as above glass transition temperature, where material properties may be significantly different. In general, failure mechanisms may be accelerated by a various forms of temperature stresses including temperature cycle, time dependent temperature change and spatial gradient of temperature or non-temperature stresses including humidity, shock and vibration. Variability of field use conditions often make the task of developing correlations more difficult.
Keywords :
failure analysis; glass transition; humidity; life testing; reliability; thermal management (packaging); thermal shock; time to market; -55 to 125 degC; accelerated life testing; defect identification; design weakness identification; development timeline; failure mechanism; failure mode; glass transition temperature; humidity; life estimation; reliability; stresses; test to fixed life approach; thermal shock; time to market requirement; vibration; Acceleration; Electric shock; Failure analysis; Humidity; Life estimation; Life testing; Product development; Temperature dependence; Thermal stresses; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1318375
Filename :
1318375
Link To Document :
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