DocumentCode
3243724
Title
Interconnect design and packaging issues of laptop to networks
Author
Koon, John W.
fYear
1995
fDate
7-9 Nov. 1995
Firstpage
400
Abstract
As competition heats up, it is essential to design the best products at the lowest possible cost. This means combining the knowledge of what new technologies are available to save assembly time, observe all the basic rules to make sure that the devices meet all the FCC EMI requirements and still get the products to the market in a timely manner. And, of course, there will be a lot of design tradeoffs decisions along the way. In this paper, the issues and design considerations of interconnect of laptop to network are discussed. A list of design and packaging considerations is provided for developers´ references when doing a PC card product design
Keywords
Assembly; Connectors; Costs; FCC; Ferrites; Local area networks; Modems; Packaging; Portable computers; Product design;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location
San Francisco, CA, USA
ISSN
1095-791X
Print_ISBN
0-7803-2636-9
Type
conf
DOI
10.1109/WESCON.1995.485414
Filename
485414
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