• DocumentCode
    3243724
  • Title

    Interconnect design and packaging issues of laptop to networks

  • Author

    Koon, John W.

  • fYear
    1995
  • fDate
    7-9 Nov. 1995
  • Firstpage
    400
  • Abstract
    As competition heats up, it is essential to design the best products at the lowest possible cost. This means combining the knowledge of what new technologies are available to save assembly time, observe all the basic rules to make sure that the devices meet all the FCC EMI requirements and still get the products to the market in a timely manner. And, of course, there will be a lot of design tradeoffs decisions along the way. In this paper, the issues and design considerations of interconnect of laptop to network are discussed. A list of design and packaging considerations is provided for developers´ references when doing a PC card product design
  • Keywords
    Assembly; Connectors; Costs; FCC; Ferrites; Local area networks; Modems; Packaging; Portable computers; Product design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-2636-9
  • Type

    conf

  • DOI
    10.1109/WESCON.1995.485414
  • Filename
    485414