DocumentCode :
3243724
Title :
Interconnect design and packaging issues of laptop to networks
Author :
Koon, John W.
fYear :
1995
fDate :
7-9 Nov. 1995
Firstpage :
400
Abstract :
As competition heats up, it is essential to design the best products at the lowest possible cost. This means combining the knowledge of what new technologies are available to save assembly time, observe all the basic rules to make sure that the devices meet all the FCC EMI requirements and still get the products to the market in a timely manner. And, of course, there will be a lot of design tradeoffs decisions along the way. In this paper, the issues and design considerations of interconnect of laptop to network are discussed. A list of design and packaging considerations is provided for developers´ references when doing a PC card product design
Keywords :
Assembly; Connectors; Costs; FCC; Ferrites; Local area networks; Modems; Packaging; Portable computers; Product design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location :
San Francisco, CA, USA
ISSN :
1095-791X
Print_ISBN :
0-7803-2636-9
Type :
conf
DOI :
10.1109/WESCON.1995.485414
Filename :
485414
Link To Document :
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