Title :
Interconnect design and packaging issues of laptop to networks
Abstract :
As competition heats up, it is essential to design the best products at the lowest possible cost. This means combining the knowledge of what new technologies are available to save assembly time, observe all the basic rules to make sure that the devices meet all the FCC EMI requirements and still get the products to the market in a timely manner. And, of course, there will be a lot of design tradeoffs decisions along the way. In this paper, the issues and design considerations of interconnect of laptop to network are discussed. A list of design and packaging considerations is provided for developers´ references when doing a PC card product design
Keywords :
Assembly; Connectors; Costs; FCC; Ferrites; Local area networks; Modems; Packaging; Portable computers; Product design;
Conference_Titel :
WESCON/'95. Conference record. 'Microelectronics Communications Technology Producing Quality Products Mobile and Portable Power Emerging Technologies'
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-2636-9
DOI :
10.1109/WESCON.1995.485414