Title :
Three-dimensional passive circuit technology for ultra-compact MMICs
Author :
Hirano, Masahiro ; Nishikawa, Kiisa ; Toyoda, Ichihiko ; Aoyama, Shoichiro ; Sugitani, S. ; Yamasaki, Kazuhiko
Author_Institution :
NTT LSI Labs., Atsugi, Japan
Abstract :
A novel passive circuit technology of a three-dimensional (3D) metal-insulator structure has been developed for ultra-compact MMICs. By combining vertical passive elements, such as a wall-like microwire for shielding or coupling and a pillar-like via connection, with multilayer passive circuits, highly dense and more functional MMICs can be implemented.<>
Keywords :
MMIC; integrated circuit technology; passive networks; functional MMICs; metal-insulator structure; pillar-like via connection; three-dimensional passive circuit technology; ultra-compact MMICs; vertical passive elements; wall-like microwire; Coupling circuits; Fabrication; Gold; Insulation; Laboratories; MMICs; Metal-insulator structures; Nonhomogeneous media; Passive circuits; Polyimides;
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-2581-8
DOI :
10.1109/MWSYM.1995.406245
