DocumentCode
3244318
Title
Horizontal laminar flow cleaning in wet batch cleaning process
Author
Ota, Katsuhiro ; Yamamoto, Hirokazu ; Hashi, Akiko
Author_Institution
Packaging Technol. Solutions Dept., Hitachi Ltd., Yokohama, Japan
fYear
2011
fDate
27-29 May 2011
Firstpage
304
Lastpage
308
Abstract
A novel horizontal laminar flow (HLF) cleaning is proposed for removing contamination from highly integrated semiconductor devices with high pattern densities. The proposed HLF cleaner contains fluid flow plates that realize horizontal laminar flow in the cleaning bath. This configuration effectively reduces cross contamination. The effects of laminar flow are investigated by fluid visualization. The dependence of the laminar flow on the hole diameter and the opening area ratio of the plates is clarified.
Keywords
flow visualisation; laminar flow; surface cleaning; cleaning bath; fluid flow plates; fluid visualization; hole diameter; horizontal laminar flow cleaning; integrated semiconductor devices; opening area ratio; wet batch cleaning process; Cleaning; cleaning; cross contamination; fluid visualization; laminar flow; particle removal;
fLanguage
English
Publisher
ieee
Conference_Titel
Communication Software and Networks (ICCSN), 2011 IEEE 3rd International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-61284-485-5
Type
conf
DOI
10.1109/ICCSN.2011.6014901
Filename
6014901
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