DocumentCode
3244644
Title
Dielectric, rheological and calorimetric studies of silicones used in power modules
Author
Jean-Pierre, H. ; Nadia, B. ; Emmanuel, D. ; Nathalie, M.
fYear
2004
fDate
8-10 Sept. 2004
Firstpage
562
Lastpage
566
Abstract
This work deals with the characterization of the dielectric, rheological and calorimetric properties of different silicone formulations used in power device products such as power modules and inverters. The first part reports the dynamic and kinetic study of the crosslinking process. Important discrepancies are observed between the different compounds that enables a preselection of some polymers. Rheological and dielectric experiments performed on crosslinked samples aUow the final choice according to the desired application (encapsulafion of electronic circuits in power modules).
Keywords
Dielectric devices; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Inverters; Kinetic theory; Multichip modules; Polymers; Rheology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Electronics Engineering, 2004. (ICEEE). 1st International Conference on
Conference_Location
Acapulco, Mexico
Print_ISBN
0-7803-8531-4
Type
conf
DOI
10.1109/ICEEE.2004.1433948
Filename
1433948
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