• DocumentCode
    3244644
  • Title

    Dielectric, rheological and calorimetric studies of silicones used in power modules

  • Author

    Jean-Pierre, H. ; Nadia, B. ; Emmanuel, D. ; Nathalie, M.

  • fYear
    2004
  • fDate
    8-10 Sept. 2004
  • Firstpage
    562
  • Lastpage
    566
  • Abstract
    This work deals with the characterization of the dielectric, rheological and calorimetric properties of different silicone formulations used in power device products such as power modules and inverters. The first part reports the dynamic and kinetic study of the crosslinking process. Important discrepancies are observed between the different compounds that enables a preselection of some polymers. Rheological and dielectric experiments performed on crosslinked samples aUow the final choice according to the desired application (encapsulafion of electronic circuits in power modules).
  • Keywords
    Dielectric devices; Dielectric materials; Dielectric substrates; Dielectrics and electrical insulation; Inverters; Kinetic theory; Multichip modules; Polymers; Rheology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Electronics Engineering, 2004. (ICEEE). 1st International Conference on
  • Conference_Location
    Acapulco, Mexico
  • Print_ISBN
    0-7803-8531-4
  • Type

    conf

  • DOI
    10.1109/ICEEE.2004.1433948
  • Filename
    1433948