Title :
Microwave characterization of flip-chip MMIC interconnections
Author :
Marks, R.B. ; Jargon, Jeffrey A. ; Pao, C.K. ; Wen, Cheng P.
Author_Institution :
Nat. Inst. of Stand. & Technol., Boulder, CO, USA
Abstract :
We report accurate on-wafer measurements of transmission lines on flip-chip coplanar-waveguide MMICs. The effects are difficult to predict theoretically, and, without custom standards and unique calibration software, measurements would be intractable. The results are applicable to the development of an accurate CAD database. We also report and apply a new technique for the measurement of transmission line capacitance.<>
Keywords :
MMIC; circuit CAD; coplanar waveguides; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; accurate CAD database; coplanar-waveguide MMICs; flip-chip MMIC interconnections; on-wafer measurements; transmission line capacitance; Calibration; Capacitance measurement; Coplanar transmission lines; Databases; MMICs; Measurement standards; Software measurement; Software standards; Transmission line measurements; Transmission line theory;
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-2581-8
DOI :
10.1109/MWSYM.1995.406249
