DocumentCode :
3245045
Title :
Comparison between beryllium-copper and tungsten high frequency air coplanar probes
Author :
Carbonera, Joel Luis ; Morin, Gerard ; Cabon, Beatrice
Author_Institution :
Centra R&D, SGS-Thomson Microelectron., Crolles, France
fYear :
1995
fDate :
16-20 May 1995
Firstpage :
1475
Abstract :
High frequency air coplanar probes using tungsten tips are now available for wafer probing with aluminum pads. Comparative study of the beryllium-copper and tungsten behavior is presented in terms of contact resistance values, stability and reproducibility. Finally, tungsten is demonstrated to be the best material for breaking the aluminum oxide over the pad to enable accurate high frequency probing.<>
Keywords :
contact resistance; coplanar waveguides; integrated circuit measurement; microwave integrated circuits; microwave measurement; probes; BeCu; Si; W; contact resistance values; high frequency air coplanar probes; microwave measurement; reproducibility; stability; wafer probing; Aluminum oxide; Conducting materials; Contact resistance; Electrical resistance measurement; Frequency measurement; Hafnium; Needles; Probes; Silicon; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-2581-8
Type :
conf
DOI :
10.1109/MWSYM.1995.406252
Filename :
406252
Link To Document :
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