• DocumentCode
    3245439
  • Title

    Static and dynamic breakdown characteristics of cryogenic liquids for electrical insulation design of superconducting power apparatus

  • Author

    Chigusa, S. ; Hayakawa, N. ; Okubo, H.

  • Author_Institution
    Dept. of Electr. Eng., Nagoya Univ., Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    470
  • Lastpage
    473
  • Abstract
    We investigated the quench-induced dynamic breakdown characteristics of liquid helium (LHe) for various post-quench thermal energy, gap lengths and pressures of LHe under both non-uniform and uniform electric field. Experimental results revealed that the dynamic breakdown voltage increased with decreasing the post-quench thermal energy and with increasing the gap length and pressure, because of the suppression of thermal bubble disturbance in LHe. All of the experimental data enabled us to establish the 3-dimensionally systematized diagram of dynamic breakdown voltage of LHe as functions of post-quench thermal energy, gap length and pressure
  • Keywords
    dielectric liquids; electric breakdown; helium; insulating oils; superconducting coils; 3-dimensionally systematized diagram; He; cryogenic liquids; dynamic breakdown characteristics; dynamic breakdown voltage; electrical insulation design; gap length; gap lengths; liquid He; nonuniform electric field; post-quench thermal energy; pressure; quench-induced dynamic breakdown characteristics; static breakdown characteristics; superconducting power apparatus; thermal bubble disturbance; uniform electric field; Breakdown voltage; Cryogenics; Dielectric liquids; Dielectrics and electrical insulation; Electric breakdown; Electric fields; Electrodes; Nonuniform electric fields; Superconductivity; Thermal quenching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Dielectric Liquids, 1999. (ICDL '99) Proceedings of the 1999 IEEE 13th International Conference on
  • Conference_Location
    Nara
  • Print_ISBN
    0-7803-4759-5
  • Type

    conf

  • DOI
    10.1109/ICDL.1999.798974
  • Filename
    798974