DocumentCode :
3245643
Title :
Micromechanical sensors
Author :
Benecke, W.
Author_Institution :
Fraunhofer Inst. fuer Mikrostrukturtechnik, Berlin, West Germany
fYear :
1989
fDate :
8-12 May 1989
Firstpage :
14305
Lastpage :
17227
Abstract :
System integration is often limited by the incompatibility of the technologies used for the fabrication of sensors and actuators. Most of the problems related to conventional transducers, such as miniaturization, performance, and price, can be overcome by the use of silicon as a mechanical material. Therefore, there is a rapidly increasing demand for micromachined silicon transducers. The author reviews the advantages of silicon for sensor applications and the relevant characteristics of silicon. He outlines the fabrication processes used for silicon micromachining. The potential of this technology is illustrated by various examples of micromechanical sensors. The multidisciplinary use of silicon for mechanical and electronic functions on the same chip leads to completely new sensor and system concepts. Included are piezoelectric and piezoresistive devices, piezojunction transistors, accelerometers, and pressure, tactile, flow, radiation and chemical sensors. Diagrams, graphs, and photographs are provided
Keywords :
electric sensing devices; piezoelectric transducers; piezoresistance; accelerometers; actuators; chemical sensors; fabrication processes; flow; micromechanical sensors; piezoelectric; piezojunction; piezoresistive; pressure; radiation; sensor applications; sensors; silicon micromachining; silicon transducers; tactile; Actuators; Chemical sensors; Fabrication; Mechanical sensors; Micromachining; Micromechanical devices; Sensor phenomena and characterization; Sensor systems; Silicon; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
CompEuro '89., 'VLSI and Computer Peripherals. VLSI and Microelectronic Applications in Intelligent Peripherals and their Interconnection Networks', Proceedings.
Conference_Location :
Hamburg
Print_ISBN :
0-8186-1940-6
Type :
conf
DOI :
10.1109/CMPEUR.1989.93403
Filename :
93403
Link To Document :
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