Critical Temperature to Dielectric Degradation of Printed Circuit Board

Author

Liu, Yong ; Du, B. ; Zhang, Xiangjin ; Xin Jiang

Author_Institution

Sch. of Electr. Eng. & Autom., Tianjin Univ.

fYear

2006

fDate

38869

Firstpage

92

Lastpage

94

Abstract

Dielectric degradation of printed circuit board based on the thermal properties in an open-air environment was investigated. With increase of the temperature, the copper electrodes were oxidized from Cu ₂O to CuO; the base material of epoxy laminate was thermally affected to the change of molecular structure and degradation of dielectric properties. With increase of the temperature, the capacitance and surface resistance decreased, the thermal stimulated current increased and showed a valley value near 450 K and a peak value near 490 K

Keywords

copper compounds; epoxy insulation; insulation testing; permittivity; printed circuit testing; thermoelectricity; Cu₂O; CuO; capacitance; copper electrodes; critical temperature; dielectric constant; dielectric degradation; epoxy laminate; molecular structure; open-air environment; printed circuit board; surface resistance; thermal properties; thermal stimulated current; Capacitance; Copper; Dielectric materials; Electrodes; Laminates; Printed circuits; Surface resistance; Temperature; Thermal degradation; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and applications of Dielectric Materials, 2006. 8th International Conference on

Conference_Location

Bali

Print_ISBN

1-4244-0189-5

Electronic_ISBN

1-4244-0190-9

Type

conf

DOI

10.1109/ICPADM.2006.284125

Filename

4062614