Title :
Nondestructive evaluation of TAB bonds by acoustic microscopy
Author :
Kessler, L.W. ; Semmens, J.E. ; Cichanski, F.T.
Author_Institution :
Sonoscan Inc., Bensenville, IL, USA
Abstract :
A matrix of TAB (tape automated bonding) inner and outer lead devices with a built-in range of quality was investigated. Each bond interface was documented acoustically and then pull-tested to develop a database upon which to formulate a specific test method. Data demonstrate excellent correlation between the degree of bonding and correlative pull tests (destructive) when artifacts of the pull test were compensated. A series of probability curves was generated to predict pull strength from SLAM data alone. In particular, the scanning laser acoustic microscope (SLAM) produces real-time images (30 fields of view per second) at ultrasonic frequencies from 10 to 200 MHz. The speed of scan and the practicality of acoustic microscopy make the method potentially viable for nondestructive evaluation of microelectronic packaging. A standard is proposed for inclusion in MIL-STD 883
Keywords :
acoustic microscopy; inspection; integrated circuit technology; lead bonding; nondestructive testing; packaging; quality control; 10 to 200 MHz; MIL-STD 883; NDE; SLAM data; TAB bonds; acoustic microscopy; built-in range of quality; correlative pull tests; database; degree of bonding; inner lead devices; microelectronic packaging; nondestructive evaluation; outer lead devices; practicality; probability curves; pull strength prediction; pull-tested; real-time images; scanning laser acoustic microscope; specific test method; speed of scan; tape automated bonding; ultrasonic frequencies; Acoustic testing; Benchmark testing; Bonding; Conducting materials; Frequency; Inspection; Lead; Microscopy; Simultaneous localization and mapping; Ultrasonic imaging;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1989, Proceedings. Seventh IEEE/CHMT International
Conference_Location :
San Francisco, CA
DOI :
10.1109/EMTS.1989.68999
