DocumentCode :
3247784
Title :
Construction kit for low-cost vibration analysis systems based on low-cost acceleration sensors
Author :
Vollmer, Josef ; Hu, Yanting ; Neumann, Thomas ; Solda, Erik
Author_Institution :
Hochschule Bonn-Rhein-Sieg, Univ. of Appl. Sci., St. Augustin, Germany
fYear :
2009
fDate :
14-17 July 2009
Firstpage :
463
Lastpage :
468
Abstract :
Low-cost vibration analysis systems are of high interest to be integrated in low-cost and medium-cost machines and equipment of everyday life. This article presents a construction kit for building up such low-cost vibration analysis systems. The construction kit contains micromechanical acceleration sensors with measurement ranges plusmn1.7 g up to plusmn70 g and frequency ranges from 0...400 Hz up to 0...10 kHz. The sensors have to be supplemented with analog filters. Simple RC-filters or Bessel-filters are proposed for noise reduction, Tchebycheff-filters built up as Sallen-Key-filters are proposed for anti-aliasing. Data acquisition and also digital signal processing is done with standard microcontrollers, calculating simple rms values or performing a Fast-Fourier-Transformation. The construction kit shows ways to choose a microcontroller and also literature presenting detailed algorithms. The accuracy of the measurement systems is in the area of 1% for simple signal processing and up to 15% performing a FFT.
Keywords :
data acquisition; fast Fourier transforms; microsensors; noise abatement; signal processing; vibrations; Bessel filters; RC filters; Sallen-Key filters; Tchebycheff filters; antialiasing; data acquisition; digital signal processing; fast Fourier transformation; microcontrollers; micromechanical acceleration sensors; noise reduction; vibration analysis systems; Acceleration; Accelerometers; Data acquisition; Filters; Frequency measurement; Microcontrollers; Micromechanical devices; Noise reduction; Sensor systems; Signal processing algorithms;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Intelligent Mechatronics, 2009. AIM 2009. IEEE/ASME International Conference on
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2852-6
Type :
conf
DOI :
10.1109/AIM.2009.5229969
Filename :
5229969
Link To Document :
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