• DocumentCode
    3247784
  • Title

    Construction kit for low-cost vibration analysis systems based on low-cost acceleration sensors

  • Author

    Vollmer, Josef ; Hu, Yanting ; Neumann, Thomas ; Solda, Erik

  • Author_Institution
    Hochschule Bonn-Rhein-Sieg, Univ. of Appl. Sci., St. Augustin, Germany
  • fYear
    2009
  • fDate
    14-17 July 2009
  • Firstpage
    463
  • Lastpage
    468
  • Abstract
    Low-cost vibration analysis systems are of high interest to be integrated in low-cost and medium-cost machines and equipment of everyday life. This article presents a construction kit for building up such low-cost vibration analysis systems. The construction kit contains micromechanical acceleration sensors with measurement ranges plusmn1.7 g up to plusmn70 g and frequency ranges from 0...400 Hz up to 0...10 kHz. The sensors have to be supplemented with analog filters. Simple RC-filters or Bessel-filters are proposed for noise reduction, Tchebycheff-filters built up as Sallen-Key-filters are proposed for anti-aliasing. Data acquisition and also digital signal processing is done with standard microcontrollers, calculating simple rms values or performing a Fast-Fourier-Transformation. The construction kit shows ways to choose a microcontroller and also literature presenting detailed algorithms. The accuracy of the measurement systems is in the area of 1% for simple signal processing and up to 15% performing a FFT.
  • Keywords
    data acquisition; fast Fourier transforms; microsensors; noise abatement; signal processing; vibrations; Bessel filters; RC filters; Sallen-Key filters; Tchebycheff filters; antialiasing; data acquisition; digital signal processing; fast Fourier transformation; microcontrollers; micromechanical acceleration sensors; noise reduction; vibration analysis systems; Acceleration; Accelerometers; Data acquisition; Filters; Frequency measurement; Microcontrollers; Micromechanical devices; Noise reduction; Sensor systems; Signal processing algorithms;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Intelligent Mechatronics, 2009. AIM 2009. IEEE/ASME International Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2852-6
  • Type

    conf

  • DOI
    10.1109/AIM.2009.5229969
  • Filename
    5229969