• DocumentCode
    3248198
  • Title

    Studies on the Application of Carbon Nanotube as Interconnects for Nanometric VLSI Circuits

  • Author

    Thiruvenkatesan, C. ; Raja, J.

  • Author_Institution
    Dept. of E.C.E., SSN Coll. of Eng., Chennai, India
  • fYear
    2009
  • fDate
    16-18 Dec. 2009
  • Firstpage
    162
  • Lastpage
    167
  • Abstract
    The performance of integrated circuits has been growing exponentially, which has resulted in the development of a variety of VLSI products for communications, computers, and medical applications. The increase in the performance is mainly due to the decrease in the dimensions of the integrated circuit chip. To sustain this improvement, the industry has to overcome several technological challenges in scaling the devices and interconnects. Metal interconnects have become a significant performance limiter. Carbon nanotubes have been proposed as a possible replacement for copper as an interconnect material. Multiplier circuit is used as one of the important building block in most of the digital circuits. In this paper carry-save-adder-array multiplier has been taken for study and the effects of copper interconnect and carbon nanotube interconnect are discussed. The performance of critical delay with respect to device technology is presented.
  • Keywords
    VLSI; carbon nanotubes; integrated circuit interconnections; multiplying circuits; C; carbon nanotube; carry-save-adder-array multiplier; integrated circuits; medical applications; metal interconnects; multiplier circuit; nanometric VLSI circuit interconnection; Application software; Application specific integrated circuits; Biomedical equipment; Carbon nanotubes; Computer applications; Copper; Integrated circuit interconnections; Integrated circuit technology; Medical services; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Emerging Trends in Engineering and Technology (ICETET), 2009 2nd International Conference on
  • Conference_Location
    Nagpur
  • Print_ISBN
    978-1-4244-5250-7
  • Electronic_ISBN
    978-0-7695-3884-6
  • Type

    conf

  • DOI
    10.1109/ICETET.2009.214
  • Filename
    5395458