Title :
Microelectronics reliability
Author :
Meredith, John W.
Author_Institution :
Hewlett-Packard, Colorado Springs, CO, USA
Abstract :
The author points out the importance of the involvement of the design and manufacturing team in achieving reliability of microelectronic devices. A method of verifying reliability goals through calculation of failure rates based on life test parameters is described. An example illustrating the method is shown
Keywords :
hybrid integrated circuits; integrated circuit testing; monolithic integrated circuits; reliability; ICs; failure rates; hybrid ICs; life test parameters; microelectronic devices; monolithic ICs; reliability; Feedback; Hybrid integrated circuits; Integrated circuit packaging; Integrated circuit reliability; Manufacturing processes; Microelectronics; Power system reliability; Silicon; Temperature; Testing;
Conference_Titel :
IEEE Region 5 Conference, 1988: 'Spanning the Peaks of Electrotechnology'
Conference_Location :
Colorado Springs, CO
DOI :
10.1109/REG5.1988.15935
