Title :
Thermal modeling of hybrid microelectronics
Author :
Reed, Dan L. ; Gartner, Bryan W.
Author_Institution :
Hewlett-Packard, Colorado Springs, CO, USA
Abstract :
An outline is presented of a computer thermal analysis model that inputs information for existing computer-aided design (CAD) layout files. This model assumes conductive heat flow to determine the difference in temperature from the junction-to-case for multiple heat sources and uses this information to create a CAD-compatible drawing of the isotherms. The development and input/output of the model are discussed. The model is verified by using experimental data obtained from hybrids built-up with thermal test chips.<>
Keywords :
circuit CAD; hybrid integrated circuits; integrated circuit technology; CAD; computer thermal analysis model; hybrid ICs; hybrid microelectronics; junction-to-case; multiple heat sources; Design automation; Equations; Heat transfer; Impedance; Integrated circuit modeling; Microelectronics; Resistance heating; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
IEEE Region 5 Conference, 1988: 'Spanning the Peaks of Electrotechnology'
Conference_Location :
Colorado Springs, CO, USA
DOI :
10.1109/REG5.1988.15938
