DocumentCode
3249316
Title
Non-Destructive Quality Evaluation in Spice Industry with Specific Reference to Cuminum Cyminum L (Cumin) Seeds
Author
Jain, Kavindra R. ; Modi, Chintan K. ; Patel, Jalpa J.
Author_Institution
EC Dept, G.H. Patel Coll. of Eng. & Technol., Vallabh Vidyanagar, India
fYear
2009
fDate
16-18 Dec. 2009
Firstpage
458
Lastpage
463
Abstract
The Indian spice industry by and large is primitive yet. Screen cleaner and dust removing are the only operations which are being done alone in the industry. Quality assessment of spices is a very big challenge since time immemorial. In addition to inherent and hygienic features quality depends on its physical appearance, moisture content, composition which may be reflected by taste and smell too. Human sensory panel generally assess quality and such process is time consuming, unreliable and non reproducible. There is a need for some non invasive quality testing methodologies. This paper proposes a new method for counting the number of Cuminum cyminum L (cumin seeds)with long pedestals as well as foreign elements using machine vision non destructive technique based on combined measurements.
Keywords
computer vision; food processing industry; food products; nondestructive testing; production engineering computing; quality control; Cuminum cyminum L seeds; Indian spice industry; combined measurements; cumin seeds; dust removing; human sensory panel; hygienic features quality; machine vision; moisture content; nondestructive quality evaluation; noninvasive quality testing methodologies; pedestals; quality assessment; screen cleaner; Consumer electronics; Educational institutions; Food industry; Humans; Image processing; Machine vision; Manufacturing industries; Pricing; Quality assessment; Quality control;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Trends in Engineering and Technology (ICETET), 2009 2nd International Conference on
Conference_Location
Nagpur
Print_ISBN
978-1-4244-5250-7
Electronic_ISBN
978-0-7695-3884-6
Type
conf
DOI
10.1109/ICETET.2009.161
Filename
5395509
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