DocumentCode :
3249418
Title :
Application of technology CAD in process development for high performance logic and system-on-chip in IC foundry
Author :
Liew, B.K. ; Wang, C.C. ; Diaz, C.H. ; Wu, S.Y. ; Sun, Y.C. ; Lin, Y.F. ; Kuo, D.S. ; Lin, H.T. ; Yen, A.
Author_Institution :
Taiwan, Hsinchu, Taiwan
fYear :
1999
fDate :
1999
Firstpage :
3
Lastpage :
6
Abstract :
In recent years, IC foundry leaders such as TSMC have invested heavily in leading edge process technologies. These technologies are developed to meet market demand from fabless, integrated device manufacturers as well as system companies. The application spectrum spans high performance logic/mixed-mode processes used in fabricating microprocessors, DSP´s, and also embedded memory technologies that enable system-on-chip designs such as logic/mixed mode IC´s with integrated SRAM, DRAM, nonvolatile memories. The use of TCAD tools is imperative to accelerate the development of these processes, meet high performance targets, ensure process compatibility and manufacturability, minimize development cost especially for embedded memory technologies. This paper gives an overview of TCAD application in process development within TSMC R&D. The challenges of using TCAD tools in the IC foundry will also be discussed
Keywords :
DRAM chips; SRAM chips; digital signal processing chips; flash memories; logic simulation; mixed analogue-digital integrated circuits; proximity effect (lithography); semiconductor process modelling; technology CAD (electronics); DRAM; DSP chips; IC foundry; SRAM; development cost; embedded memory technologies; flash cell design; high performance logic; integrated memories; manufacturability; mask layout; microprocessors; mixed-mode processes; nonvolatile memories; process compatibility; process development; proximity correction; system-on-chip; technology CAD; virtual fab environment; Application specific integrated circuits; Digital signal processing; Foundries; Logic design; Logic devices; Manufacturing; Microprocessors; Nonvolatile memory; Random access memory; System-on-a-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
4-930813-98-0
Type :
conf
DOI :
10.1109/SISPAD.1999.799245
Filename :
799245
Link To Document :
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