• DocumentCode
    3249418
  • Title

    Application of technology CAD in process development for high performance logic and system-on-chip in IC foundry

  • Author

    Liew, B.K. ; Wang, C.C. ; Diaz, C.H. ; Wu, S.Y. ; Sun, Y.C. ; Lin, Y.F. ; Kuo, D.S. ; Lin, H.T. ; Yen, A.

  • Author_Institution
    Taiwan, Hsinchu, Taiwan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    3
  • Lastpage
    6
  • Abstract
    In recent years, IC foundry leaders such as TSMC have invested heavily in leading edge process technologies. These technologies are developed to meet market demand from fabless, integrated device manufacturers as well as system companies. The application spectrum spans high performance logic/mixed-mode processes used in fabricating microprocessors, DSP´s, and also embedded memory technologies that enable system-on-chip designs such as logic/mixed mode IC´s with integrated SRAM, DRAM, nonvolatile memories. The use of TCAD tools is imperative to accelerate the development of these processes, meet high performance targets, ensure process compatibility and manufacturability, minimize development cost especially for embedded memory technologies. This paper gives an overview of TCAD application in process development within TSMC R&D. The challenges of using TCAD tools in the IC foundry will also be discussed
  • Keywords
    DRAM chips; SRAM chips; digital signal processing chips; flash memories; logic simulation; mixed analogue-digital integrated circuits; proximity effect (lithography); semiconductor process modelling; technology CAD (electronics); DRAM; DSP chips; IC foundry; SRAM; development cost; embedded memory technologies; flash cell design; high performance logic; integrated memories; manufacturability; mask layout; microprocessors; mixed-mode processes; nonvolatile memories; process compatibility; process development; proximity correction; system-on-chip; technology CAD; virtual fab environment; Application specific integrated circuits; Digital signal processing; Foundries; Logic design; Logic devices; Manufacturing; Microprocessors; Nonvolatile memory; Random access memory; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    4-930813-98-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.1999.799245
  • Filename
    799245