DocumentCode
3249908
Title
Optimization of temperature-time profiles in rapid thermal annealing
Author
Bork, I. ; Molzer, W. ; Nguyen, Ch D.
Author_Institution
Infineon Technol., Munich, Germany
fYear
1999
fDate
1999
Firstpage
107
Lastpage
109
Abstract
Rapid thermal annealing (RTA) is widely used in modern IC technology to reduce the amount of transient enhanced diffusion (TED) of dopants after ion implantation. The effect of diffusion reduction due to fast temperature ramping (50°C/s and above) and short annealing times (less than 10 seconds at 1000°C) is well known. However, a systematic investigation of TED over a broad range of temperature-time conditions can, to the authors´ best knowledge, not be found in the literature yet. In this simulation study we investigate phosphorus TED between 600°C and 1100°C for annealing times from a few seconds to several hours
Keywords
doping profiles; ion implantation; rapid thermal annealing; annealing time; fast temperature ramping; ion implantation; rapid thermal annealing; temperature-time profiles; transient enhanced diffusion; Area measurement; Electronic mail; Equations; Implants; Ion implantation; Rapid thermal annealing; Semiconductor process modeling; Simulated annealing; Temperature dependence; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location
Kyoto
Print_ISBN
4-930813-98-0
Type
conf
DOI
10.1109/SISPAD.1999.799272
Filename
799272
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