DocumentCode :
3249965
Title :
A bulk-micromachined comb accelerometer with floating interconnects
Author :
Xiong, Xingguo ; Lu, Deren ; Wang, Weiyuan
Author_Institution :
Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH
fYear :
2005
fDate :
7-10 Aug. 2005
Firstpage :
147
Abstract :
In this paper, a silicon-on-glass bulk-micromachined comb accelerometer with floating interconnect is introduced. The device uses unique floating back interconnect for the connection of the fixed comb fingers, which leads to more compact design. Based upon the analysis of the device behavior, an optimized device design is proposed. Simulation results show that the device has a static capacitance of 2.8pF and sensitivity of 17.9nm/g. The fabrication sequence of the accelerometer is discussed. The floating interconnection technique may be applied to other bulk-micromachined MEMS devices for 3D interconnection
Keywords :
accelerometers; interconnections; micromachining; microsensors; 2.8 pF; bulk micromachining; comb accelerometer; floating back interconnects; silicon-on-glass accelerometer; Accelerometers; Electrostatics; Fingers; Glass; Information technology; Integrated circuit interconnections; Micromechanical devices; Parasitic capacitance; Residual stresses; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2005. 48th Midwest Symposium on
Conference_Location :
Covington, KY
Print_ISBN :
0-7803-9197-7
Type :
conf
DOI :
10.1109/MWSCAS.2005.1594060
Filename :
1594060
Link To Document :
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