• DocumentCode
    3249965
  • Title

    A bulk-micromachined comb accelerometer with floating interconnects

  • Author

    Xiong, Xingguo ; Lu, Deren ; Wang, Weiyuan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Cincinnati Univ., OH
  • fYear
    2005
  • fDate
    7-10 Aug. 2005
  • Firstpage
    147
  • Abstract
    In this paper, a silicon-on-glass bulk-micromachined comb accelerometer with floating interconnect is introduced. The device uses unique floating back interconnect for the connection of the fixed comb fingers, which leads to more compact design. Based upon the analysis of the device behavior, an optimized device design is proposed. Simulation results show that the device has a static capacitance of 2.8pF and sensitivity of 17.9nm/g. The fabrication sequence of the accelerometer is discussed. The floating interconnection technique may be applied to other bulk-micromachined MEMS devices for 3D interconnection
  • Keywords
    accelerometers; interconnections; micromachining; microsensors; 2.8 pF; bulk micromachining; comb accelerometer; floating back interconnects; silicon-on-glass accelerometer; Accelerometers; Electrostatics; Fingers; Glass; Information technology; Integrated circuit interconnections; Micromechanical devices; Parasitic capacitance; Residual stresses; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2005. 48th Midwest Symposium on
  • Conference_Location
    Covington, KY
  • Print_ISBN
    0-7803-9197-7
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2005.1594060
  • Filename
    1594060