DocumentCode :
3250049
Title :
Where we are with Energy Efficiency in telecom equipment in North America INTELEC 2008 - San Diego, CA
Author :
Elkenaney, Mahmoud ; Kujan, Beth
fYear :
2008
fDate :
14-18 Sept. 2008
Firstpage :
1
Lastpage :
4
Abstract :
Doing business in the United States today means focusing on creating a greener, more energy efficient product. Though industry in general - globally and domestically - has been aware of the need for more eco-friendly products for a while now, it is really only in the last three years that major American corporations have truly begun to focus on the need to be green. Here in the telecommunications industry, we have grown increasingly concerned about the carbon footprints left by our products. And while this concern exists for a variety of reasons - including economic incentives as well as eco-sustainability - nowhere is it more obvious than in a report done by The Climate Group for Global e-sustainability Initiative (Gesi) regarding the effects of the telecommunication and aviation industries on the world around us. While most Americans are more than cognizant of the pollution and carbon footprints left each time they hop aboard an airplane, few ever think of the amount of energy expanded by the telecommunication equipment they use on a daily basis.
Keywords :
energy conservation; environmental factors; telecommunication equipment; telecommunication industry; INTELEC 2008; North America; USA; carbon footprints; eco-friendly products; energy efficiency; energy efficient product; telecommunication equipment; Carbon dioxide; Communication industry; Energy efficiency; Environmental economics; Germanium silicon alloys; Industrial economics; North America; Power generation economics; Silicon germanium; Telecommunications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Energy Conference, 2008. INTELEC 2008. IEEE 30th International
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2055-1
Electronic_ISBN :
978-1-4244-2056-8
Type :
conf
DOI :
10.1109/INTLEC.2008.4664036
Filename :
4664036
Link To Document :
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