DocumentCode :
3250060
Title :
A FEM-MD combination method for silicon
Author :
Izumi, Satoshi ; Kawakami, Takashi ; Sakai, Shinsuke
Author_Institution :
Res. & Dev. Center, Toshiba Corp., Japan
fYear :
1999
fDate :
1999
Firstpage :
143
Lastpage :
146
Abstract :
A new method combining the finite element method (FEM) and the molecular dynamics (MD) for silicon is proposed. For simultaneous simulation, the patch model was used to exchange displacement information in both directions. A one-to-one correspondence of atoms and nodes is impossible for silicon lattice, therefore the atom was embedded in isoparametric element. The influence of internal displacement which is the additional displacement to the continuum one was taken into consideration. Martin´s method was applied to calculate internal displacement and elastic constants. The verification model showed that the smooth transition of displacement and stress was realized in the boundary region of FEM and MD. These value showed good agreement with elastic solution
Keywords :
elastic constants; elemental semiconductors; finite element analysis; internal stresses; molecular dynamics method; silicon; Martin method; Si; elastic constants; finite element method; internal displacement; isoparametric element; lattice structure; molecular dynamics method; patch model; silicon; stress distribution; Boundary conditions; Finite element methods; Interpolation; Lattices; Nanoscale devices; Nanostructures; Research and development; Silicon; Supercomputers; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
4-930813-98-0
Type :
conf
DOI :
10.1109/SISPAD.1999.799281
Filename :
799281
Link To Document :
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