• DocumentCode
    3250060
  • Title

    A FEM-MD combination method for silicon

  • Author

    Izumi, Satoshi ; Kawakami, Takashi ; Sakai, Shinsuke

  • Author_Institution
    Res. & Dev. Center, Toshiba Corp., Japan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    143
  • Lastpage
    146
  • Abstract
    A new method combining the finite element method (FEM) and the molecular dynamics (MD) for silicon is proposed. For simultaneous simulation, the patch model was used to exchange displacement information in both directions. A one-to-one correspondence of atoms and nodes is impossible for silicon lattice, therefore the atom was embedded in isoparametric element. The influence of internal displacement which is the additional displacement to the continuum one was taken into consideration. Martin´s method was applied to calculate internal displacement and elastic constants. The verification model showed that the smooth transition of displacement and stress was realized in the boundary region of FEM and MD. These value showed good agreement with elastic solution
  • Keywords
    elastic constants; elemental semiconductors; finite element analysis; internal stresses; molecular dynamics method; silicon; Martin method; Si; elastic constants; finite element method; internal displacement; isoparametric element; lattice structure; molecular dynamics method; patch model; silicon; stress distribution; Boundary conditions; Finite element methods; Interpolation; Lattices; Nanoscale devices; Nanostructures; Research and development; Silicon; Supercomputers; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    4-930813-98-0
  • Type

    conf

  • DOI
    10.1109/SISPAD.1999.799281
  • Filename
    799281