DocumentCode
3250060
Title
A FEM-MD combination method for silicon
Author
Izumi, Satoshi ; Kawakami, Takashi ; Sakai, Shinsuke
Author_Institution
Res. & Dev. Center, Toshiba Corp., Japan
fYear
1999
fDate
1999
Firstpage
143
Lastpage
146
Abstract
A new method combining the finite element method (FEM) and the molecular dynamics (MD) for silicon is proposed. For simultaneous simulation, the patch model was used to exchange displacement information in both directions. A one-to-one correspondence of atoms and nodes is impossible for silicon lattice, therefore the atom was embedded in isoparametric element. The influence of internal displacement which is the additional displacement to the continuum one was taken into consideration. Martin´s method was applied to calculate internal displacement and elastic constants. The verification model showed that the smooth transition of displacement and stress was realized in the boundary region of FEM and MD. These value showed good agreement with elastic solution
Keywords
elastic constants; elemental semiconductors; finite element analysis; internal stresses; molecular dynamics method; silicon; Martin method; Si; elastic constants; finite element method; internal displacement; isoparametric element; lattice structure; molecular dynamics method; patch model; silicon; stress distribution; Boundary conditions; Finite element methods; Interpolation; Lattices; Nanoscale devices; Nanostructures; Research and development; Silicon; Supercomputers; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1999. SISPAD '99. 1999 International Conference on
Conference_Location
Kyoto
Print_ISBN
4-930813-98-0
Type
conf
DOI
10.1109/SISPAD.1999.799281
Filename
799281
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