• DocumentCode
    3250131
  • Title

    Study on dielectric properties of modificated bismaleimide oligopolymer

  • Author

    Chen, Yu-Fei ; Teng, Cheng-jun ; Fan, Yong ; Lei, Qing-quan

  • Author_Institution
    Coll. of Mater. Sci. & Eng., Harbin Univ. Sci. & Technol.
  • fYear
    2006
  • fDate
    38869
  • Firstpage
    726
  • Lastpage
    728
  • Abstract
    This article describes the modified soluble bismaleimide oligopolymer, on which dielectric properties are researched. Its processing behavior is improved.The cross-linking agent-bisallyl bisphenol A(BBA) is used to modificate bismaleimide oligopolymer, and solidified in certain temperature. Some dielectric properties are made to measure, including electric breakdown strength, volume resistivity, dielectric constant, dielectric loss, and heat decomposition temperature (Td). The result demonstrated that 5%cross-linking agent can lead to the heat decomposition temperature of the material 420~460 degC, electric breakdown strength is 150KV/mm, volume resistivity is 8times1016Omegamiddotcm
  • Keywords
    decomposition; dielectric losses; dielectric materials; electric breakdown; electric strength; permittivity; polymers; bisallyl bisphenol; dielectric constant; dielectric loss; dielectric properties; electric breakdown strength; heat decomposition temperature; modified soluble bismaleimide oligopolymer; volume resistivity; Conductivity; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Electric breakdown; Electric variables measurement; Loss measurement; Resistance heating; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and applications of Dielectric Materials, 2006. 8th International Conference on
  • Conference_Location
    Bali
  • Print_ISBN
    1-4244-0189-5
  • Electronic_ISBN
    1-4244-0190-9
  • Type

    conf

  • DOI
    10.1109/ICPADM.2006.284280
  • Filename
    4062769