DocumentCode
3250131
Title
Study on dielectric properties of modificated bismaleimide oligopolymer
Author
Chen, Yu-Fei ; Teng, Cheng-jun ; Fan, Yong ; Lei, Qing-quan
Author_Institution
Coll. of Mater. Sci. & Eng., Harbin Univ. Sci. & Technol.
fYear
2006
fDate
38869
Firstpage
726
Lastpage
728
Abstract
This article describes the modified soluble bismaleimide oligopolymer, on which dielectric properties are researched. Its processing behavior is improved.The cross-linking agent-bisallyl bisphenol A(BBA) is used to modificate bismaleimide oligopolymer, and solidified in certain temperature. Some dielectric properties are made to measure, including electric breakdown strength, volume resistivity, dielectric constant, dielectric loss, and heat decomposition temperature (Td). The result demonstrated that 5%cross-linking agent can lead to the heat decomposition temperature of the material 420~460 degC, electric breakdown strength is 150KV/mm, volume resistivity is 8times1016Omegamiddotcm
Keywords
decomposition; dielectric losses; dielectric materials; electric breakdown; electric strength; permittivity; polymers; bisallyl bisphenol; dielectric constant; dielectric loss; dielectric properties; electric breakdown strength; heat decomposition temperature; modified soluble bismaleimide oligopolymer; volume resistivity; Conductivity; Dielectric constant; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Electric breakdown; Electric variables measurement; Loss measurement; Resistance heating; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
Conference_Location
Bali
Print_ISBN
1-4244-0189-5
Electronic_ISBN
1-4244-0190-9
Type
conf
DOI
10.1109/ICPADM.2006.284280
Filename
4062769
Link To Document