Title :
Study on the Dielectric Properties of Polyimide/Silica Nanocomposite Films
Author :
Zhang, Ming-yan ; Zeng, Shu-jin ; Dong, Tie-quan ; Fan, Yong ; Lei, Qing-quan
Author_Institution :
Dept. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol.
Abstract :
In the paper, the chemical structure and dielectric properties including dielectric constant epsiv and dielectric loss tandelta of organic-inorganic polyimide/silica composite films, made through sol-gel process and thermal imidization, using pyromellitic dianhydride and 4,4´-oxydianiline as organic precursors and methyl-triethoxysilane as inorganic precursor, were investigated. A coupling agent of 3-aminopropyl triethoxysilane was added in order to improve the compatibility between polyimide and inorganic phase. It turned out that the properties of films were not only relative to the inorganic content of the system, but also to the morphology of the phases and the characteristics of the interface between polyimide and the inorganic
Keywords :
chemical structure; dielectric losses; dielectric thin films; filled polymers; nanocomposites; organic-inorganic hybrid materials; permittivity; polymer films; silicon compounds; sol-gel processing; 3-aminopropyl triethoxysilane; 4,4´-oxydianiline; SiO2; chemical structure; coupling agent; dielectric constant; dielectric loss; dielectric properties; inorganic precursor; methyl-triethoxysilane; organic precursors; organic-inorganic polyimide-silica nanocomposite films; pyromellitic dianhydride; sol-gel process; thermal imidization; Chemical analysis; Dielectric constant; Dielectric loss measurement; Dielectric losses; Mechanical factors; Organic chemicals; Polyimides; Purification; Silicon compounds; Temperature;
Conference_Titel :
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
Conference_Location :
Bali
Print_ISBN :
1-4244-0189-5
Electronic_ISBN :
1-4244-0190-9
DOI :
10.1109/ICPADM.2006.284282
