Synthesis and Characterization of Corona-resistant Polyimide/AluminaHybrid Films

Author

Zhou, Hong ; Fan, Yong ; Lei, Qingquan

Author_Institution

Coll. of Mater. Sci. & Eng., Harbin Univ. of Sci. & Technol.

fYear

2006

fDate

38869

Firstpage

736

Lastpage

738

Abstract

A new class of polyimide hybrid films with various amounts of alumina has been synthesized by the sol-gel reaction and characterized. The hybrid films were obtained by the hydrolysis and polycondensation of heteropropyl-alumina in polyamic acid (PAA) solution of N, NÂ¿-dimethylacetamide (DMAc), followed by heating to 350Â°C. The chemical structure, surface morphology of the composites films were characterized by Atomic Forced Microscope (AFM) and Fourier Transform Infrared Spectroscope (FTIR). The thermal stability of the composites films was tested on Perkin-Elmer TGA7. With nano scale inorganic oxides adding, thermal stability of hybrid film was increased. The PI hybrid films showed improved electrical aging performance as compared with pure PI film..

Keywords

Fourier transform spectra; ageing; alumina; atomic force microscopy; chemical structure; condensation; heating; infrared spectra; organic-inorganic hybrid materials; polymer films; sol-gel processing; surface morphology; thermal stability; AFM; DMAc; FTIR; Fourier transform infrared spectroscope; N,N´-dimethylacetamide; Perkin-Elmer TGA7; atomic forced microscope; chemical structure; composite films; corona-resistant polyimide-alumina hybrid film characterization; corona-resistant polyimide-alumina hybrid film synthesis; electrical aging; heating; heteropropyl-alumina in polyamic acid solution; hydrolysis; nanoscale inorganic oxides; polycondensation; sol-gel reaction; surface morphology; thermal stability; Atomic force microscopy; Chemicals; Fourier transforms; Heating; Infrared spectra; Polyimides; Spectroscopy; Surface morphology; Testing; Thermal stability;

fLanguage

English

Publisher

ieee

Conference_Titel

Properties and applications of Dielectric Materials, 2006. 8th International Conference on

Conference_Location

Bali, Indonesia

Print_ISBN

1-4244-0189-5

Electronic_ISBN

1-4244-0190-9

Type

conf

DOI

10.1109/ICPADM.2006.284283

Filename

4062772