Four layer BGA design optimization for improved thermal performance and lower cost

Author

Zhou, Tiao ; Morelli, Arianna ; Villa, Claudio

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

Volume

2

fYear

2004

fDate

1-4 June 2004

Firstpage

1194

Abstract

Optimization of 4 layer (4L) BGA thermal performance with best reliability and cost compromise is presented. Effects of design variables on thermal performance, reliability and cost are examined with both experiments and simulation. Long term thermal performance and solder joint reliability is also presented. It is found that removal of soldermask at DA are gives thermal improvement. With conventional DA, up to 20% soldermask opening can be used. It is demonstrated that by optimizing the die pad and solder mask pattern the thermal performance of a 4L BGA can be improved without degrade the reliability and addition cost.

Keywords

ball grid arrays; integrated circuit reliability; microassembling; reflow soldering; thermal conductivity; thermal management (packaging); thermal resistance; design optimization; design variables; die attach thermal conductivity; die pad pattern; four layer BGA; improved thermal performance; long term thermal performance; lower cost; reliability cost compromise; solder joint reliability; solder mask pattern; thermal path analysis; thermal resistance; Conducting materials; Constraint optimization; Cost function; Design optimization; Dielectric materials; Dielectric substrates; Electronic packaging thermal management; Materials reliability; Soldering; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2004. Proceedings. 54th

Print_ISBN

0-7803-8365-6

Type

conf

DOI

10.1109/ECTC.2004.1319063

Filename

1319063