DocumentCode
3250570
Title
Electron beam characteristics of double-gated Si field emitter arrays
Author
Toma, Y. ; Kanemaru, S. ; Itoh, J.
Author_Institution
Ebara Res. Co. Ltd., Japan
fYear
1995
fDate
July 30 1995-Aug. 3 1995
Firstpage
9
Lastpage
13
Abstract
Double-gate Si field emitter arrays (FEAs) were fabricated in order to generate a focused electron beam and their characteristics were studied. These devices were fabricated by reactive ion etching followed by double successive evaporation of insulating layer and electrode. In these devices, the lower gate is used as an extraction electrode and the upper one is used as an electrostatic focusing lens. The devices presented here have 1.2 /spl mu/m-lower-gate-openings and 2.2-/spl mu/m-upper-gate-openings which are smaller than those previously reported. In this paper, beam characteristics and experimental results of e-beam exposure to a PMMA resist (poly-methyl-methacrylate) are reported.
Keywords
cold-cathode tubes; electron beams; electron field emission; elemental semiconductors; silicon; sputter etching; vacuum microelectronics; 1.2 micron; 2.2 micron; PMMA resist; Si; cold cathode; double successive evaporation; double-gated field emitter arrays; electron beam characteristics; electrostatic focusing lens; extraction electrode; focused electron beam; lower-gate-openings; reactive ion etching; upper-gate-openings; vacuum microelectronics; Electrodes; Electron beams; Electron emission; Etching; Field emitter arrays; Insulation; Niobium; Phosphors; Scanning electron microscopy; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Microelectronics Conference, 1995. IVMC., 1995 International
Conference_Location
Portland, OR, USA
Print_ISBN
0-7803-2143-X
Type
conf
DOI
10.1109/IVMC.1995.486979
Filename
486979
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