A beyond-1 GHz AMBA high-speed bus for SoC DSP platforms

This paper presents an on-chip interconnection infrastructure based on ARM´s AHB standard to obtain a bus working beyond one gigahertz. All major design blocks necessary to implement reliable interconnect infrastructures for DSP platforms are presented. This interconnect infrastructure is implemented as a hard IP module to get the maximum performance out of TSMC´s 0.18 μm CMOS technology. As a result, a bus operating at 1.4 GHz capable of transferring 2.8 giga data items per second was successfully designed.