• DocumentCode
    3250750
  • Title

    A HASS profile research method based on computer simulation technology

  • Author

    Wang, Li-Zhi ; Jiang, Tong-Min ; Li, Xiao-Yang ; Sun, Fu-Qiang

  • Author_Institution
    Sch. of Reliability & Syst. Eng., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
  • fYear
    2010
  • fDate
    29-31 Oct. 2010
  • Firstpage
    911
  • Lastpage
    915
  • Abstract
    To identify and eliminate the product´s early failures with the lowest cost and the best effect, this paper proposes a HASS profile research method based on computer simulation technology. Firstly, the flow and implement steps are introduced, then take the solder joint as an example, to show the application of the computer simulation method in a specific way, finally, summarizes the application prospect of the method. Through the method above, the manufacturer´ cost would be saved as well as their competitiveness would be improved.
  • Keywords
    digital simulation; failure analysis; production engineering computing; solders; computer simulation technology; highly accelerated stress screening profile research method; product failure; solder joint; Computational modeling; Computers; Educational institutions; Fatigue; Life estimation; Load modeling; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IE&EM), 2010 IEEE 17Th International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-6483-8
  • Type

    conf

  • DOI
    10.1109/ICIEEM.2010.5646478
  • Filename
    5646478