Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips

Author

Sturdivant, R.

Author_Institution

Autom. Electron. Group, TRW Inc., Redondo Beach, CA, USA

fYear

1995

fDate

16-20 May 1995

Firstpage

1591

Abstract

Flip chip technology has been used in electronic equipment for 25 years or more. This is due to the benefits offered by flip chips such as improved interconnect performance, high reliability, and low cost. Increased packaging demands in wireless communications, and military electronics have lead to the use of flip chips for r.f. and microwave components. For instance, GaAs MMIC flip chips at 15 Ghz have been developed. There a few key technology issues which allow the use of flip chip at microwave frequencies. The most important being the use of coplanar transmission lines. The impact of flipping a MMIC chip is examined using finite element simulations and test data is presented for a flipped microwave GaAs MMIC.<>

Keywords

III-V semiconductors; MMIC; circuit analysis computing; finite element analysis; flip-chip devices; gallium arsenide; integrated circuit reliability; integrated circuit technology; 15 GHz; GaAs; MMIC flip chips; coplanar transmission lines; cost; finite element simulations; flip chip technology; interconnect performance; mounting substrate; packaging demands; reliability; test data; Costs; Electronic equipment; Electronics packaging; Flip chip; Gallium arsenide; MMICs; Microwave devices; Military communication; Packaging machines; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1995., IEEE MTT-S International

Conference_Location

Orlando, FL, USA

ISSN

0149-645X

Print_ISBN

0-7803-2581-8

Type

conf

DOI

10.1109/MWSYM.1995.406280

Filename

406280