DocumentCode :
3250899
Title :
Yield analysis for self-repairable MEMS devices
Author :
Xiong, Xingguo ; Wu, Yu-Liang ; Jone, Wen-Ben
Author_Institution :
Dept. of ECECS, Cincinnati Univ., OH
fYear :
2005
fDate :
7-10 Aug. 2005
Firstpage :
359
Abstract :
In this paper, the yield analysis for a self-repairable MEMS (SRMEMS) accelerometer design is proposed. The accelerometer consists of (n + m) identical modules: n of them serve as the main device, while the remaining m modules act as the redundancy. The yield model for MEMS redundancy repair is developed by statistical analysis. Based upon the yield model, the yield increase after redundancy repair for the SRMEMS accelerometer is derived. The yield increase versus initial yield for different m numbers is simulated. The simulation results show that the SRMEMS leads to effective yield increase compared to non-BISRS design, especially for a moderate initial yield
Keywords :
accelerometers; built-in self test; microsensors; redundancy; statistical analysis; MEMS redundancy repair; SRMEMS accelerometer; micromechanical devices; self-repairable MEMS accelerometer; self-repairable MEMS devices; statistical analysis; yield analysis; Acceleration; Accelerometers; Capacitance; Circuits; Fabrication; Fingers; Microelectromechanical devices; Micromechanical devices; Redundancy; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2005. 48th Midwest Symposium on
Conference_Location :
Covington, KY
Print_ISBN :
0-7803-9197-7
Type :
conf
DOI :
10.1109/MWSCAS.2005.1594112
Filename :
1594112
Link To Document :
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