Title :
The Influence of Resistivity and Dielectric Constant of Soil Which is Injected by Low to High Current Frequency
Author :
Anggoro, Bambang ; Sinisuka, Ngapuli I. ; Pakpahan, Parouli M.
Author_Institution :
Sch. Electr. Eng. & Informatics, Inst. Teknologi Bandung
Abstract :
Grounding system in actual consist of electrodes configuration (vertical, horizontal, grid) and soil where these electrodes are planted. The grounding system which is installed to power systems or lightning protection system will be injected by low to high frequency. Electrical characteristic of soil (resistivity and dielectric constant) will be varied caused by injected current frequency variation. The variation of resistivity and dielectric constant depend on mineral composition of soil. As we know well that the soil constant of clay, silt, sand and gravel. Clay have an unstable chemical bonding and silt, sand and gravel have a stable chemical bonding, so if we have to know the type of clay for investigating the resistivity and dielectric constant of soil. In this experiment we used the soil with water treatment. Frequency of power supply is 0 Hz-13 MHz. The computation for investigating resistivity and dielectric constant used circuit equivalent of soil. Resistivity and dielectric constant will descend with frequency ascent, but the formulation of descending depends on the type of clay
Keywords :
bonds (chemical); clay; earth electrodes; electrical resistivity; lightning protection; permittivity; power system protection; sand; soil; chemical bonding; circuit equivalent; clay; dielectric constant; gravel; grid electrodes; grounding system; horizontal electrodes; lightning protection system; mineral composition; power systems; resistivity; sand; silt; soil constant; soil electrical characteristics; vertical electrodes; water treatment; Bonding; Chemicals; Conductivity; Dielectric constant; Electrodes; Frequency; Grounding; Lightning protection; Power system protection; Soil; Soil; clay; dielectric; resistivity;
Conference_Titel :
Properties and applications of Dielectric Materials, 2006. 8th International Conference on
Conference_Location :
Bali
Print_ISBN :
1-4244-0189-5
Electronic_ISBN :
1-4244-0190-9
DOI :
10.1109/ICPADM.2006.284325