DocumentCode :
3251353
Title :
Stochastic analysis of partial discharge patterns deriving from electrical tree measurements
Author :
Bozzo, R. ; Contin, A. ; Cacciari, M. ; Guastavino, F. ; Gemme, C. ; Montanari, G.C.
Author_Institution :
Dipartimento di Ingegneria Elettrica, Genoa Univ., Italy
fYear :
1995
fDate :
10-13 Jul 1995
Firstpage :
381
Lastpage :
385
Abstract :
The partial discharge height distributions resulting from tree-growth tests performed by needle-plane electrodes in specimens of EVA copolymer, at different levels of constant voltage and room temperature, are studied. The tests are performed on specimens displaying either an intimate contact of the needle with the copolymer or an artificial void at the needle tip. It is shown that the stochastic behavior of the pulse charge height distribution depends on test conditions, but generally fits well a two-parameter Weibull function when either partial discharges occur in the void or tree grows into the polymer in the absence of artificial void. A five-parameter Weibull function can be used to fit data which are obtained when the detected partial discharges are due to both tree growing into the polymer and partial discharge evolution into the artificial void. Estimation of the Weibull parameter values, as well as of other statistical indexes, can describe well the observed partial discharge phenomena and provide useful diagnostic tools
Keywords :
Weibull distribution; insulation testing; organic insulating materials; partial discharges; polymer blends; stochastic processes; trees (electrical); voids (solid); 20 C; EVA copolymer; artificial void; constant voltage; diagnostic tools; electrical tree measurements; five-parameter Weibull function; needleplane electrodes; partial discharge height distributions; partial discharge patterns; partial discharges; pulse charge height distribution; room temperature; stochastic analysis; test conditions; tree-growth tests; two-parameter Weibull function; Electrodes; Needles; Partial discharges; Pattern analysis; Performance evaluation; Polymers; Stochastic processes; Temperature distribution; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Conduction and Breakdown in Solid Dielectrics, 1995. ICSD'95., Proceedings of the 1995 IEEE 5th International Conference on
Conference_Location :
Leicester
Print_ISBN :
0-7803-2040-9
Type :
conf
DOI :
10.1109/ICSD.1995.523013
Filename :
523013
Link To Document :
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