DocumentCode :
3251385
Title :
Indium tilted channel implantation technology for 60 nm nMOSFET
Author :
Momiyama, Y. ; Yamaguchi, S. ; Ohkubo, S. ; Sugii, T.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
fYear :
1999
fDate :
14-16 June 1999
Firstpage :
67
Lastpage :
68
Abstract :
We have developed a new laterally modulated channel technology that enables complete operation of 60 nm nMOSFETs using a tilted In implantation. This improves short channel immunity over the conventional device using B because of its steeper lateral profile and sufficiently high activation ratio. Using this technology, we realized roll-off free characteristics down to 100 nm with a low enough V/sub th/ of 0.18 V and 0.1 V for 60 nm nMOSFETs. We also show that there are no penalties with use of In from device or reliability points of view.
Keywords :
MOSFET; doping profiles; indium; ion implantation; semiconductor device reliability; semiconductor device testing; 0.1 V; 0.18 V; 60 nm; Si:In; activation ratio; indium tilted channel implantation technology; laterally modulated channel technology; nMOSFET; nMOSFETs; reliability; roll-off free characteristics; short channel immunity; steep lateral profile; threshold voltage; tilted In implantation; Implants; Impurities; Indium; Isolation technology; Laboratories; Length measurement; MOSFET circuits; Maintenance; Power MOSFET; Power system reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on
Conference_Location :
Kyoto, Japan
Print_ISBN :
4-930813-93-X
Type :
conf
DOI :
10.1109/VLSIT.1999.799343
Filename :
799343
Link To Document :
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