DocumentCode :
3251627
Title :
The effects of fill gases on the failure rate of gated silicon field emitter arrays
Author :
Meassick, S. ; Champaign, H.
Author_Institution :
Dept. of Eng., New Mexico Highlands Univ., Las Vagas, NM, USA
fYear :
1995
fDate :
July 30 1995-Aug. 3 1995
Firstpage :
207
Lastpage :
210
Abstract :
The influence of a variety of background gasses on the failure rate of gated field emitter arrays has been investigated. The effects of argon, helium, nitrogen and xenon were investigated, with pressures ranging from 1/spl times/10/sup -8/ Torr to 1/spl times/10/sup -4/ Torr. The gated field emitter arrays were operated in DC and pulsed emission modes. The failure rate of gated field emitter is a very strong function of the type of background gas, its pressure and whether the array was operated in a pulsed or DC bias mode. As expected, the failure rate for all gases increased rapidly as the background pressure increased, but was substantially different for the various gases. The failure rate of arrays increased rapidly as the electron impact ionization cross section of the background gas decreased. The large reduction in failure rates due to operation in a pulsed mode as compared to a DC mode of operation as previously seen for experiments without a background gas was also evident for all background gases tested.
Keywords :
argon; electron field emission; electron tube testing; elemental semiconductors; failure analysis; helium; impact ionisation; nitrogen; reliability; silicon; vacuum microelectronics; xenon; 1E-8 to 1E-4 torr; Ar; DC bias mode; He; N; Si; Xe; background gasses; electron impact ionization cross section; failure rate; fill gases; gas pressure; gated field emitter arrays; pulsed emission mode; Argon; Electrons; Field emitter arrays; Gases; Helium; Impact ionization; Nitrogen; Silicon; Testing; Xenon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Microelectronics Conference, 1995. IVMC., 1995 International
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-2143-X
Type :
conf
DOI :
10.1109/IVMC.1995.487026
Filename :
487026
Link To Document :
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