R-1 technology challenges for scaled Cu/low k interconnects

Summary form only given, as follows. Although copper interconnects have now been still unclear when comparing Cu with the more mature demonstrated on certain high performance products, AI technology. This session will address the technical significant technology challenges remain, including: Cu and strategic advantages and issues associated with the integration with low k dielectrics, scaling dual introduction of Cu/oxide and Cu/low k dielectrics with damascene structures and reliability of Cu/low k inter- the goal of highlighting industry needs and timeline for connects. In addition, the cost versus performance Cu technology insertion.