Thermal Analysis of the Multi-Chip Vertical Packaged White LED

In this paper, thermal management of the multi-chip vertical packaged (MCVP) white LED is presented. The steady state thermal resistance (R_T) and thermal resistance constitution is obtained by transient response testing based on electrical method. R_T is 10.37degC/W. The chips and package body contributes 2.63degC/W and 7.74degC/W respectively. The temperature distribution of the MCVP LED is obtained by 3-dimensional finite element method (FEM) simulation. By comparing heating response curves among different package forms´ LED samples, the MCVP sample shares lowest steady state temperature rise with the metal alloyed substrate sample, which is lower than 18.3degC of the single flip-chip sub-mounted device (SMD) sample and 15.3degC of the multi-chip horizontal packaged (MCHP) sample.