DocumentCode :
3252133
Title :
Nanoscale heat transfer and nanostructured thermoelectrics
Author :
Chen, Gang
Author_Institution :
Mech. Eng. Dept., Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
8
Abstract :
Heat transfer at nanoscales differs significantly from that in macroscales because of size effects on the phonon and electron transport. Nanoscale heat transfer effects have significant implications for the microelectronic and microphotonic industries, from the thermal management, the device design and reliability, and the active cooling considerations. Past studies have shown that heat conduction in nanostructures can be significantly impeded below that of the predictions of the Fourier theory. Such size effects imply higher device temperatures than anticipated and demands more stringent thermal management measures. On the other hand, similar size effects can be exploited for developing highly efficient thermoelectric materials for direct cooling. This paper starts with a discussion some nanoscale heat transfer effects and their impacts on the device performance, particularly using thermal conductivity reduction in superlattices as an example, followed by a review of recent developments in nanostructured thermoelectric materials.
Keywords :
Fourier analysis; Ge-Si alloys; III-V semiconductors; IV-VI semiconductors; aluminium compounds; bismuth compounds; cooling; gallium arsenide; indium compounds; integrated circuit design; integrated circuit reliability; lead compounds; nanostructured materials; phonons; semiconductor materials; semiconductor quantum dots; semiconductor superlattices; semiconductor thin films; size effect; thermal conductivity; thermal management (packaging); thermoelectric devices; thermoelectricity; Bi2Te3-Sb2Te3; Fourier theory; GaAlAs; InAs-AlSb; InP; PbTe-PbSe; PbTe-PbSeTe; Si-Ge; active cooling; electron transport; heat conduction; microelectronic industries; microphotonic industries; nanoscale heat transfer; nanostructured thermoelectric materials; phonon size effects; reliability; superlattices; thermal conductivity; thermal management; Conducting materials; Cooling; Electrons; Heat transfer; Nanoscale devices; Nanostructured materials; Phonons; Thermal conductivity; Thermal management; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319148
Filename :
1319148
Link To Document :
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