Defect Analysis of Electric and Photonic Double Layer Substrate made by SIMOX 3D sculpting

Author

Kishima, Koichiro

Author_Institution

Mater. Labs., Sony Corp., Tokyo

fYear

2006

fDate

2-5 Oct. 2006

Firstpage

33

Lastpage

34

Abstract

From the viewpoint of electric device fabrication, we examined a SIMOX 3D sculpting method (Koonath, 2003) that three dimensionally integrate electric circuits and photonic circuits on an SOI substrate. We investigated buried optical waveguide structure underneath the silicon surface and defect characteristics on the surface of the substrate made by 8" size SIMOX 3D sculpting. As a result, we showed that balancing between no defects on the silicon surface and a formation of buried waveguide is achievable when the BOX by SIMOX 3D sculpting is continuous

Keywords

SIMOX; buried layers; integrated circuit testing; integrated optics; optical waveguides; semiconductor technology; substrates; 8 in; SIMOX 3D sculpting method; SOI substrate; buried oxide; buried waveguide; double layer defect analysis; electric double layer; electric-photonic circuit integration; photonic substrate double layer; Annealing; Circuits; Ion implantation; Optical surface waves; Optical waveguides; Oxygen; Particle beam optics; Silicon; Surface waves; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

International SOI Conference, 2006 IEEE

Conference_Location

Niagara Falls, NY

ISSN

1078-621X

Print_ISBN

1-4244-0289-1

Electronic_ISBN

1078-621X

Type

conf

DOI

10.1109/SOI.2006.284419

Filename

4062867