• DocumentCode
    3252385
  • Title

    Micro IDDQ test using Lorentz force MOSFET´s

  • Author

    Nose, K. ; Sakurai, T.

  • Author_Institution
    Inst. of Ind. Sci., Tokyo Univ., Japan
  • fYear
    1999
  • fDate
    14-16 June 1999
  • Firstpage
    167
  • Lastpage
    168
  • Abstract
    Recently, the number of transistors in VLSIs has increased rapidly, which makes it difficult to find the locations of design errors and/or the locations of small circuit/process margins. The most common design errors are bridges and opens in interconnections. In order to detect these design errors and achieve low operational and standby currents, the IDDQ test is effective. In the conventional IDDQ test, however, the locations of these problems can not be identified, since only the currents of several power supply lines that are separated internally and have separate external pins can be checked. As each power supply line connects to so many transistors, it is impossible to pinpoint the error locations. It is possible to identify the location of errors if the current of thousands of internal power supply lines can be checked. In this paper, a current sensing device, the Lorentz force MOSFET (LMOS), is proposed to achieve this goal. The LMOS makes a noncontact and nondisturbing current measurement possible, which is different from the insertion of resistors in the power supply lines which degrades circuit speed in normal operation. It is also possible to check the quiescent current of thousands of macros on a chip, which we call a micro IDDQ test. While magnetic sensing devices have also been reported (Doyle and Lyden, 1994; Hone-Ming Yang et al., 1997), they are not suitable for micro IDDQ tests.
  • Keywords
    MOSFET; VLSI; electric current measurement; electric sensing devices; fault location; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; IDDQ test; Lorentz force MOSFETs; VLSI transistors; circuit/process margin location; current sensing device; design error location; design errors; error location; external pins; interconnect bridges; interconnect opens; interconnections; internal power supply lines; macros; magnetic sensing devices; micro IDDQ test; noncontact current measurement; nondisturbing current measurement; operational current; power supply line currents; quiescent current; resistor insertion; standby current; Bridge circuits; Circuit testing; Current measurement; Integrated circuit interconnections; Lorentz covariance; MOSFET circuits; Pins; Power supplies; Resistors; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1999. Digest of Technical Papers. 1999 Symposium on
  • Conference_Location
    Kyoto, Japan
  • Print_ISBN
    4-930813-93-X
  • Type

    conf

  • DOI
    10.1109/VLSIT.1999.799396
  • Filename
    799396