DocumentCode :
3252797
Title :
Optimization of pin-fin heat sinks using entropy generation minimization
Author :
Khan, W.A. ; Culham, J.R. ; Yovanovich, M.M.
Author_Institution :
Dept. of Mech. Eng., Waterloo Univ., Kingston, Ont., Canada
fYear :
2004
fDate :
1-4 June 2004
Firstpage :
259
Abstract :
In this study, an entropy generation minimization, EGM, technique is applied as a unique measure to study the thermodynamic losses caused by heat transfer and pressure drop in cylindrical pin-fin heat sinks. The use of EGM allows the combined effect of thermal resistance and pressure drop to be assessed through the simultaneous interaction with the heat sink. A general expression for the entropy generation rate is obtained by considering the whole heat sink as a control volume and applying the conservation equations for mass and energy with the entropy balance. Analytical/empirical correlations for heat transfer coefficients and friction factors are used in the optimization model, where the characteristic length is used as the diameter of the pin and reference velocity used in Reynolds number and pressure drop is based on the minimum free area available for the fluid flow. Both in-line and staggered arrangements are studied and their relative performance is compared on the basis of equal overall volume of heat sinks. It is shown that all relevant design parameters for pin-fin heat sinks, including geometric parameters, material properties and flow conditions can be simultaneously optimized.
Keywords :
electronics packaging; friction; heat sinks; heat transfer; minimum entropy methods; thermal conductivity; thermal resistance; Reynolds number; analytical empirical correlations; characteristic length; cylindrical pin fin heat sinks; entropy generation minimization; fluid flow; friction factors; geometric parameters; heat transfer coefficients; in-line arrangements; mass-energy conservation equation; material properties; optimization model; pressure drop; staggered arrangement; thermal resistance; thermodynamic losses; Electrical resistance measurement; Entropy; Genetic expression; Heat sinks; Heat transfer; Loss measurement; Pressure measurement; Resistance heating; Thermal resistance; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
Print_ISBN :
0-7803-8357-5
Type :
conf
DOI :
10.1109/ITHERM.2004.1319183
Filename :
1319183
Link To Document :
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