Thermal design and optimization of staggered polymer pin fin natural convection heat sinks

Author

Bahadur, Raj ; Bar-Cohen, Avram

Author_Institution

Dept. of Mech. Eng., Maryland Univ., College Park, MD, USA

fYear

2004

fDate

1-4 June 2004

Firstpage

268

Abstract

The design and optimization of a thermally conductive PPS polymer pin fin heat sink, for an advanced natural convection cooled microprocessor application, are described. The geometric dependence of heat dissipation and the relationships between the pin fin length, pin diameter, horizontal spacing, and pin fin density for a fixed base area and excess temperature are discussed. The coefficient of thermal performance, COP_T, that relates cooling capability to the energy invested in the formation of the heat sink, has been determined for such heat sinks and compared with conventional aluminum heat sinks. The thermal performance results obtained confirm that PPS (polyphenylene sulphide) polymer heat sinks provide a promising alternative to heat sinks fabricated of conventional materials.

Keywords

cooling; heat sinks; natural convection; polymers; thermal conductivity; thermal expansion; thermal management (packaging); PPS polymer pin fin heat sink optimization; cooled microprocessor application; cooling; heat dissipation; horizontal spacing; natural convection; pin diameter; pin fin density; pin fin length; polyphenylene sulphide heat sinks; staggered polymer; thermal design; thermal expansion coefficient; thermal performance; Aluminum; Conducting materials; Design optimization; Heat engines; Heat sinks; Heat transfer; Polymers; Space heating; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on

Print_ISBN

0-7803-8357-5

Type

conf

DOI

10.1109/ITHERM.2004.1319184

Filename

1319184