• DocumentCode
    3252959
  • Title

    Cooling performance of triangular folded fin heat sinks in a duct flow

  • Author

    Ji, Tae Ho ; Kim, Seo Young ; Chang, Keun Sun

  • Author_Institution
    Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., South Korea
  • fYear
    2004
  • fDate
    1-4 June 2004
  • Firstpage
    325
  • Abstract
    Experiments have been performed to investigate the cooling performance of triangular folded-fin heat sinks made of aluminum in a duct flow. The dimension of the triangular folded fin heat sink is 70 mm in width and 92 mm in length with a 10 mm thick base plate. The fin height is varied from 19 mm to 36 mm and the fin pitch from 4 mm to 8 mm. The duct air velocity is in the range of 0.7∼5 m/s and the corresponding Reynolds number based on the hydraulic diameter is varied from 159 to 2280. The cooling performance of triangular folded fin heat sink is expressed in terms of the averaged Nusselt number and thermal resistance. The experimental results show that the present triangular folded-fin heat sinks exhibit higher cooling performance compared to a conventional extruded plate-fin heat sink with the same fin height. The cooling performance of triangular folded-fin heat sink is significantly influenced by the fin height, the fin pitch and the Reynolds number. By compiling the experimental data, a heat transfer correlation is provided for effective design of triangular folded fin heat sinks.
  • Keywords
    aluminium; convection; cooling; heat sinks; pipe flow; thermal management (packaging); thermal resistance; 0.7 to 5 m/s; 10 mm; 19 to 36 mm; 4 to 8 mm; 70 mm; 92 mm; Al; Nusselt number; Reynolds number; aluminum heat sink; cooling; duct air velocity; duct flow; fin height; fin pitch; heat transfer; hydraulic diameter; thermal resistance; triangular folded fin heat sink; Ducts; Electronics cooling; Heat sinks; Heat transfer; Hydraulic diameter; Mechanical engineering; Resistance heating; Sun; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on
  • Print_ISBN
    0-7803-8357-5
  • Type

    conf

  • DOI
    10.1109/ITHERM.2004.1319192
  • Filename
    1319192