• DocumentCode
    3252982
  • Title

    Analysis of the electrical characteristics of novel ESD protection device with high holding voltage under various temperatures

  • Author

    Won, Jong-Il ; Lee, Hyun-Duck ; Lee, Kang-Yoon ; Kim, Kwi-Dong ; Koo, Yong-Seo

  • Author_Institution
    Dept. of Electron. Eng., Seokyeong Univ., Seoul, South Korea
  • fYear
    2009
  • fDate
    23-26 Jan. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The paper introduces a silicon controlled rectifier (SCR)-based device with high holding voltage for ESD power clamp. The holding voltage can be increased by extending a p+ cathode to the first n-well and adding second n-well wrapping around n+ cathode. The increase of the holding voltage above the supply voltage enables latch-up immune normal operation. The device is fabricated by 0.35 um BCD (Bipolar-CMOS-DMOS) technology and investigated not only the electrical characteristics, but also temperature dependence of holding voltage/current in a wide temperature range from 300 K to 500 K. In the measurement result, the proposed device has holding voltage of 8 V and second breakdown current of 80 mA/um. At high temperature condition of above 400 K, the holding voltage, holding current and second breakdown current of the proposed device rapidly decrease.
  • Keywords
    CMOS integrated circuits; bipolar integrated circuits; electric breakdown; electrostatic discharge; thyristors; BCD technology; ESD power clamp; ESD protection device; bipolar-CMOS-DMOS technology; breakdown current; electrical characteristics; holding current; holding voltage; latch-up immune normal operation; n-well wrapping; silicon controlled rectifier-based device; supply voltage; temperature dependence; Breakdown voltage; Cathodes; Clamps; Electric variables; Electrostatic discharge; Protection; Temperature dependence; Temperature distribution; Thyristors; Wrapping; ESD; High Holding Voltage; Low Trigger Voltage; SCR;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2009 - 2009 IEEE Region 10 Conference
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-4546-2
  • Electronic_ISBN
    978-1-4244-4547-9
  • Type

    conf

  • DOI
    10.1109/TENCON.2009.5395895
  • Filename
    5395895