Title :
MSM cathodes using /spl beta/-SiC
Author :
Davis, P.R. ; Mackie, W.A. ; Hinrichs, C.H. ; Parsons, J.D. ; King, J.M.
Author_Institution :
Linfield Res. Inst., McMinnville, OR, USA
fDate :
July 30 1995-Aug. 3 1995
Abstract :
We have undertaken the development of a cold cathode, operating with low power and high efficiency, suitable for applications requiring modest emitted electron current densities over a broad area. The cathode consists of a sandwich of high-bandgap semiconductor material between an injecting substrate layer and a thin conducting layer which acts as the interface to the vacuum. This vacuum interface material is chosen to provide an electrical contact with the semiconductor material and must exhibit relatively low work function, resistance to corrosion or other damage, and compatibility with the semiconductor material onto which it is grown. The design is intended to provide operation of the cathode as follows. Electrons from the substrate are injected into the conduction band of the semiconductor, travel to the surface conducting film under the effect of a slight externally applied electrical bias, and are then emitted through the vacuum interface layer.
Keywords :
cathodes; current density; electron field emission; metal-semiconductor-metal structures; silicon compounds; vacuum microelectronics; wide band gap semiconductors; work function; /spl beta/-SiC; MSM cathodes; SiC; cold cathode; externally applied electrical bias; high efficiency; high-bandgap semiconductor material; injecting substrate layer; low power; thin conducting layer; vacuum interface layer; Cathodes; Conducting materials; Contact resistance; Corrosion; Current density; Electric resistance; Electron emission; Semiconductor materials; Substrates; Surface resistance;
Conference_Titel :
Vacuum Microelectronics Conference, 1995. IVMC., 1995 International
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-2143-X
DOI :
10.1109/IVMC.1995.487095