DocumentCode :
3253243
Title :
An inverted microstrip line IC structure for ultra high-speed applications
Author :
Yamaguchi, Satarou ; Imai, Yuki ; Shibata, Takuma ; Otsuji, Taiichi ; Hirano, Masahiro ; Sano, Eiichi
Author_Institution :
NTT LSI Labs., Kanagawa, Japan
fYear :
1995
fDate :
16-20 May 1995
Firstpage :
1643
Abstract :
An inverted microstrip line IC structure for ultra high-speed applications is proposed. It allows a a very low-parasitic-impedance module with a flip-chip bonding, a small IC size, and performance improvements for high-speed digital ICs.<>
Keywords :
digital integrated circuits; flip-chip devices; integrated circuit interconnections; microstrip circuits; very high speed integrated circuits; flip-chip bonding; inverted microstrip line; low-parasitic-impedance module; microstrip line IC structure; ultra high-speed applications; Application specific integrated circuits; Bonding; Coplanar waveguides; High speed integrated circuits; Impedance; Laboratories; Large scale integration; Microstrip; Packaging; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location :
Orlando, FL, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-2581-8
Type :
conf
DOI :
10.1109/MWSYM.1995.406292
Filename :
406292
Link To Document :
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