DocumentCode
3253243
Title
An inverted microstrip line IC structure for ultra high-speed applications
Author
Yamaguchi, Satarou ; Imai, Yuki ; Shibata, Takuma ; Otsuji, Taiichi ; Hirano, Masahiro ; Sano, Eiichi
Author_Institution
NTT LSI Labs., Kanagawa, Japan
fYear
1995
fDate
16-20 May 1995
Firstpage
1643
Abstract
An inverted microstrip line IC structure for ultra high-speed applications is proposed. It allows a a very low-parasitic-impedance module with a flip-chip bonding, a small IC size, and performance improvements for high-speed digital ICs.<>
Keywords
digital integrated circuits; flip-chip devices; integrated circuit interconnections; microstrip circuits; very high speed integrated circuits; flip-chip bonding; inverted microstrip line; low-parasitic-impedance module; microstrip line IC structure; ultra high-speed applications; Application specific integrated circuits; Bonding; Coplanar waveguides; High speed integrated circuits; Impedance; Laboratories; Large scale integration; Microstrip; Packaging; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location
Orlando, FL, USA
ISSN
0149-645X
Print_ISBN
0-7803-2581-8
Type
conf
DOI
10.1109/MWSYM.1995.406292
Filename
406292
Link To Document