DocumentCode :
3253283
Title :
Comparison of Tri-gate FET Characteristics for Various Hydrogen Annealing Process Conditions
Author :
Zaman, R.J. ; Mathews, K. ; Quintanilla, R. ; Banerjee, S.K.
Author_Institution :
ATDF, Austin, TX
fYear :
2006
fDate :
2-5 Oct. 2006
Firstpage :
139
Lastpage :
140
Abstract :
Hydrogen anneal improves the multigate on-off characteristics considerably (Choi, 2003), however, a higher anneal temperature also results in silicon loss from the fin, thereby reducing the effective width of the device, which degrades its total drive current. This, in turn, offsets the improved mobility-driven drive current gain. To retain the tri-gate fin height after hydrogen anneal, a hard mask based process was developed
Keywords :
MOSFET; annealing; elemental semiconductors; hydrogen; silicon; H; Si; hard mask based process; hydrogen annealing process conditions; mobility-driven drive current gain; multigate on-off characteristics; silicon loss; tri-gate FET characteristics; tri-gate fin height; Annealing; Conference proceedings; Etching; FETs; Hydrogen; MOSFETs; Scanning electron microscopy; Silicon; Temperature; USA Councils;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
International SOI Conference, 2006 IEEE
Conference_Location :
Niagara Falls, NY
ISSN :
1078-621X
Print_ISBN :
1-4244-0289-1
Electronic_ISBN :
1078-621X
Type :
conf
DOI :
10.1109/SOI.2006.284474
Filename :
4062922
Link To Document :
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